Pulsed Power

Electro Chemical Processing Laboratory


Electro Chemical Processing Laboratory (ECP)

  • Over plating power flow surfaces for final processing
  • Plating/Electro-forming on sacrificial mandrels
  • Electro-polishing and electro-cleaning of stainless steel
  • Aluminum electroforming capability on PMMA substrates
  • Ni & Cu Electroless Plating
  • Au electroforming for 200 um wall thicknesses
  • Developed Zincating Aluminum Electroplating process for depositing gold onto aluminum substrate
  • In-house bath titrations/bath maintenance, stripping, cleaning line, metrology


Surface finishes of  < 0.05 µ  on low sulfur
alloys for Power Flow Physics/Emission Mitigation

Aluminum electroplating

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