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Electro Chemical Processing Laboratory
Electro Chemical Processing Laboratory (ECP)
Over plating power flow surfaces for final processing
Plating/Electro-forming on sacrificial mandrels
Electro-polishing and electro-cleaning of stainless steel
Aluminum electroforming capability on PMMA substrates
Ni & Cu Electroless Plating
Au electroforming for 200 um wall thicknesses
Developed Zincating Aluminum Electroplating process for depositing gold onto aluminum substrate
In-house bath titrations/bath maintenance, stripping, cleaning line, metrology
Surface finishes of < 0.05 µ on low sulfur
alloys for Power Flow Physics/Emission Mitigation
Aluminum electroplating
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